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    Arctic TEC Technologies » TEC » Micro thermoelectric cooler for Telecom application
      
    Micro thermoelectric cooler for Telecom application
    Category:  TEC

     

    Parameters

    Imax

    Input current resulting in greatest ∆T (∆Tmax), (Amps);

    Umax

    Voltage at ∆Tmax, (Volts)

    ∆Tmax

    Maximum temperature difference a module can achieve, (°C)

    Qmax

    Maximum amount of heat that can be absorbed at cold face (at I=Imax and ∆T=0), (Watts).

    Tc

    Temperature of cold face during operation, (°C)

    Th

    Temperature of hot face during operation, (°C)

    Microthermoelectric cooler (MTEC) of the „Telecom“ series are made of ceramics Al2O3 (Alumina) or AlN (Aluminium nitride) of different thickness. Parameters and dimensions of the MTECs are given in the following tables.

    Al2O3 ceramics of 0,5mm thickness AlN ceramics of 0,5mm thickness
    Al2O3 ceramics of 0,32mm thickness AlN ceramics of 0,25mm thickness


    MTEC Assembling:
    1. Solder SnSb (Tmelt = 230°C) – ROHS Conform
    2. Solder PbSn (Tmelt = 183°C)
    3. Solder SnBi (Tmelt = 139°C) – ROHS Conform

     

    Standard Options

    Description

    Notation

    Note

    *Substrate material

    Alumina
    Aluminium Nitride

    Al2O3
    AlN

     

    *Max.operating temperature

    200°C
    110°C
    150°C

    T(200)
    T(110)
    T(150)

    ROHS Conform
    ROHS Conform

    Resistance tolerance

    ±10%

     

     

    Height tolerance

    ±0,05mm

     

     

    Parallelism

    ≤0,02mm

     

     

    Flatness

    ≤0,01mm

     

     

    *Wires lenght

    as directed by the customer

     

     

    *Ceramic plates of hot side and cold side

        Blank ceramic
        Metallized -  Ni-Sn
        Metallized -  Au


    Ni
    Au

     

    Vacuum cleaning and annealing

     

    VCA

     

    *specify in writing in order

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